Artificial Intelligence is being used for the multiphysics simulation of electro-mechanical systems
A complete Artificial Intelligence (AI) thermal design and analysis suite of software has been developed for electronic systems. Celsius Studio from Cadence Design Systems addresses thermal analysis and thermal stress for 2.5D and 3D-ICs and IC packaging, in addition to electronics cooling for PCBs and complete electronic assemblies.
According to Cadence, whilst current product offerings consist mostly of disparate point tools, Celsius Studio introduces an entirely new approach with a unified platform that lets electrical and mechanical/thermal engineers concurrently design, analyse and optimise product performance without the need for geometry simplification, manipulation and/or translation.
Celsius Studio examines system-level thermal integrity, converging electro-thermal co-simulation, electronics cooling and thermal stress into one combined approach.
The ability to employ Celsius Studio seamlessly for in-design multiphysics analysis allows designers to identify thermal integrity issues early in the design process and make efficient use of generative AI optimisation and novel modelling algorithms to determine ideal thermal designs.
The result is a streamlined workflow that improves collaboration, reduces design iterations and allows predictable design schedules, which in turn reduces turnaround times and accelerates time to market, according to the supplier.
ECAD/MCAD Unification provides the ability to integrate standard design file formats with no simplification as well as streamlined workflows for fast and efficient in-design analysis. In addition, AI Design Optimization using Optimality Intelligent System Explorer, which exists within Celsius Studio, enables fast and efficient exploration of all design options to help find the optimum solution.
The Micro-to-Macro Modelling function enables designers to model structures as small as the IC and its power distribution or as large as the chassis where the PCB(s) are placed. From there, the entire system can be accurately simulated with detailed granularity for any object of interest including chip, package, PCB, fan or enclosure.
The ability to perform multi-stage thermal analysis of the design provides engineers with the ability to examine the assembly process and address any 3D-IC warpage issues for multi-die stacks on a single package. It also provides the capability of combining finite element method (FEM) with computational fluid dynamics (CFD) for perform full-system thermal analysis from chip to package to board and end-system.
Celsius Studio isn’t just a stand-alone thermal analysis package. It can also be integrated easily with other electronics design, prototyping and test systems including Cadence’s Virtuoso Layout Suite, Allegro X Design Platform, Innovus Implementation System, Optimality Intelligent System Explorer and AWR Design Environment.
According to Ben Gu, corporate vice president of R&D for Multiphysics system analysis at Cadence, Celsius Studio is Cadence’s first AI platform for not only chip, package and PCB thermal analysis, but also for electronics cooling and thermal stress, something he believes is critical for today’s advanced packaging designs, inclusive of chiplets and 3D-ICs.
“Seamless integration with Cadence’s powerful implementation platforms enables users to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems,” he concludes.
One organisation that’s taking advantage of the product’s thermal analysis and simulation capabilities is Chipletz, whose VP of Engineering, Jeff Cain, says that the product is providing the design team at the company with the ability to work with detailed information early in the design cycle so that thermal problems can be targeted and resolved before the design is fully committed.
“With the reduced turnaround time, the engineering team has been empowered to efficiently run detailed thermal simulations for 3D-IC and 2.5D packages early and often as we develop these complex designs,” he says.
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