AOS LFPAK 5×6 package provides required ruggedness for high-current applications
Alpha and Omega Semiconductor (AOS) has released a highly robust power MOSFET LFPAK 5×6 package. The LFPAK is available in 40V, 60V, and 100V variants and is designed to withstand harsh environments while maintaining MOSFET performance. The new devices are found in a broad range of applications such as industrial, server power, telecommunications, and solar, where high reliability is required.
The packaging enables higher board-level reliability due to key packaging features such as gull-wing leads, which offer a rugged approach to board-level environmental stresses. The gull-wing leads also enable optical inspection during PCB manufacturing. Another feature enhancement is the LFPAK’s larger copper clip, which improves electrical and thermal performance. Advantages of the large clip include improved current handling capabilities, reduced on-resistance, and better heat dispersion compared to wire bonding. A large clip also has low parasitic inductance, enabling lower spike voltage in switching applications.
All these features significantly improve the robustness of the MOSFET, and using AOS’s advanced shielded gate MOSFET Technology (AlphaSGT) enables designers to find an optimised approach to achieving high reliability under the harshest environmental conditions.
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